21st IC & SENSOR PACKAGING TECHNOLOGY EXPO
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TECNISCO will participate in 21st IC & SENSOR PACKAGING TECHNOLOGY EXPO. We will be looking forward to seeing you there! |
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Dates : Jan.15[Wed] - 17[Fri], 2020 10:00 - 18:00 (Last day until 17:00) |
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Venue: Tokyo Big Sight , Japan Booth Location WEST 2HALL W9-40 |
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For more information, please refer to the 21st IC & SENSOR PACKAGING TECHNOLOGY EXPO Website. |
