Microchannel cooler
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Outline
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Joint program with Fraunhofer ILT (Germany) leads to the development of new-structured microchannel heat sink which gives the high power LD module a longer life. Complement effect between Cu and Mo and microprocessing technology of inside channels make it low electric-resistant and CTE-matched with LD. Au coating on the inside of the channels results in the improvement in corrosion prevention. |
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Features
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Realize higher power and longer life of the LD module
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●Possible to mount 120 W class LD
●Realize CTE (coefficient of thermal expansion) 8ppm/℃
・Possible to mount LD directly on microchannel cooler without a submount
●Realize longer life of the LD module
・CTE matching on the LD mounting area
・Complete Au coating on inside of the channel for preventing corrosion
●AuSn solder deposition on the LD mounting area
●Joint development with Fraunhofer ILT (Germany |
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Options
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●Material selection: Cu-W-Cu or Cu
(In case of Cu made MCC, a submount is required)
●Diamond turning process is available
Note: Patented in Japan, U.S. and EPC. |
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CTE matching structure
Cross section
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| (CTE is controlled by Cu-Mo-Cu 7 layers) |
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Fluid simulation
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Evaluation features of standard specification <Reference>
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| | Feature | Remarks |
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| TC |
Approx. 0.5℃/W |
500ml/min |
| Flow rate |
Approx. 500 ml/min |
150kPa |
| Warpage |
<1μm |
LD mounting area |
| Size |
11.0×20.0×1.55t(mm) |
Single type |
| 11.0×27.0×1.55t(mm) |
Stack type |
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End user market / Applications
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| Industrial laser |
・Laser equipment for welding, cutting, marking,
surface treatment(e.g. annealing), etc
・Medical laser equipment for ophthalmology and epilation, and endoscopes,etc |
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