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About "Cross-edge" microprocessing

 

20th IC & SENSOR PACKAGING TECHNOLOGY EXPO


 

   

TECNISCO will participate in 20th IC & SENSOR PACKAGING TECHNOLOGY EXPO.

We will be looking forward to seeing you there!

Dates :  Jan.16[Wed] - 18[Fri], 2019

  10:00 - 18:00 (Last day until 17:00)

Venue:  Tokyo Big Sight , Japan

              Booth Location EAST 3HALL E26-37

For more information, please refer to the 20th IC & SENSOR PACKAGING TECHNOLOGY EXPO Website.