High aspect ratio on the micro through holes
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●Multiple holes on 6-inch wafer
・（ex.）e.g. 150,000 of 0.1×0.1 mm holes on a 3-inch wafer
●High aspect through holes from 1:8 to 1:10
・Straight or taper holes are possible
● Minimize chipping size
・Improve anodic bonding performance
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Options
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●Sidewall metallization
・Protect light interference /absorption between holes
●Cavity type is selectable |
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| Standard specifications |
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| Material |
Borofloat 33 etc. |
| Glass size |
≦φ150mm |
| Min. thickness |
0.25mm |
| Thickness tolerance |
±0.01mm |
| Min. hole size |
□0.07mm |
| Hole size tolerance |
±0.02mm |
| Max. aspect ratio |
1 : 10 |
| Particle control |
Available |
| Cross-section shape |
Straight / Taper |
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Note: These are standard specifications.
In case you have any request other than these, please feel free to contact us. |
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