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About "Cross-edge" microprocessing

About "Cross-edge" microprocessing

"Cross-edge" microprocessing technology means combined technologies crossing more than two different leading-edge processing technologies to make a product. The technology is based on the following five processing technologies: Cutting, Grinding, Polishing, Metalizing, and Bonding. Through the "Cross-edge" microprocessing technology, we can provide the four advantages below by undertaking several processes as a one-stop solution partner.
 
  • ① Maintaining the stability of product quality
  • ② Shortening the lead time
  • ③ Providing better cost-performance products and services
  • ④ Solving customers’ problems by crossing our technologies and developing an original products
 
We provide products which meet our customers’ needs using our “Cross-edge” microprocessing technology. Below are some of the examples of our products and technologies.
 
 
Elemental technologies for Metal processing
 
Elemental technologies for Metal processing
 
Burr-less / sharp edge processing
For enhancing the bondability with a LD (Laser Diode) by suppressing burr size to under 5 μm max.
Burr-less / sharp edge processing details
 
Sputtering
PVD sputtering with Ti, Pt, Au, or Ni is available
Sputtering details
 
Vapor deposition
Pre-deposition of soft solder of AuSn is available for LD bonding purpose
Vapor deposition details
 
Plating
AuSn for local plating or plating of even/uneven surfaces is available
Plating details
 
Cu-Mo-Cu forming
7 layers of Cu and Mo formed into a 1.6 mm thickness
Cu-Mo-Cu forming details
 
High-flatness, warpage-less processing
For enhancing the bondability with LD by suppressing warpage to under 5 μm max.
 
Elemental technologies for Glass processing
 
Elemental technologies for Glass processing
 
Chipping-less
For enhancing bonding yield with device wafer by suppressing chipping size under 10um max.
Chipping-less details
 
Special polishing
For enhancing bondability by suppressing slope around the holes
Special polishing details
 
Small hole processing
φ0.05mm min. hole is available
Small hole processing details
 
Sputtering
PVD sputtering with Ti, Pt, Au, or Ni is available
Sputtering details
 
Plating

AuSn for local plating or plating even/uneven surface is available

Plating details
 
 
 
 
 
 
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