Jan 13,2010
LabAutomation 2010 [Jan.24-26, 2010]
Jan 13,2010
IC Packaging Technology EXPO2010 [Jan.20-22, 2010]
Sep 18,2009
SEMICON EUROPA 2009
Jun 22,2009
SEMICON West 2009
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Production equipment
Quality assurance system
Final cleaning
What is “Cross-edge” micro processing?
Can you accommodate small volume for trial production?
Is tecnisco a subsidiary of DISCO corporation?
Please send message (question, inquiry etc.)
Glass wafer with conductive through metal filled VIA
Water-cooling heatsink for high power laser
Glass micro processing
Kiru/Kezuru/Migaku
Plating/Sputtering/Vapor deposition
Assembling/Bonding
Cu/CuW/Kv/Ag/Mo etc.
Si/Al2O3/AlN/Sapphire etc.
Glass (Brofloat33, SD2, SW-YY etc.)