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Jan 13,2010
LabAutomation 2010 [Jan.24-26, 2010]
Jan 13,2010
IC Packaging Technology EXPO2010 [Jan.20-22, 2010]
Sep 18,2009
SEMICON EUROPA 2009
Jun 22,2009
SEMICON West 2009
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Development information
  • Glass wafer with conductive through metal filled VIA
  • Water-cooling heatsink for high power laser
  • Glass micro processing
Technical information
  • Kiru/Kezuru/Migaku
  • Plating/Sputtering/Vapor deposition
  • Assembling/Bonding
Processing materials
  • Cu/CuW/Kv/Ag/Mo etc.
  • Si/Al2O3/AlN/Sapphire etc.
  • Glass (Brofloat33, SD2, SW-YY etc.)

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