tecnisco DISCO DISCO
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News release News index
Jan 1, 2012
Announcement of a New Company Symbol
Dec 19, 2011
TECNISCO News Letter Vol.3
Dec 6, 2011
13th IC PACKAGING TECNOLOGY EXPO [Jan 18-20, 2012]
Dec 6, 2011
SPIE Photonics West 2012 [Jan 24-26, 2012]
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Production system
  • Production equipment
  • Quality assurance system
  • Final cleaning
  • What is “Cross-edge” micro processing?
  • Can you accommodate small volume for trial production?
  • Is tecnisco a subsidiary of DISCO corporation?

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TECNISCO News Letter/Customer Satisfaction
Development information
  • Glass wafer with conductive through metal filled VIA
  • Water-cooling heatsink for high power laser
  • Glass micro processing
Technical information
  • Kiru/Kezuru/Migaku
  • Plating/Sputtering/Vapor deposition
  • Assembling/Bonding
Processing materials
  • Cu/CuW/Kv/Ag/Mo etc.
  • Si/Al2O3/AlN/Sapphire etc.
  • Glass (Brofloat33, SD2, SW-YY etc.)

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