This CuW submount is used as a heat sink for high power LD modules. Alignment with LD, and sharp edge and control of warpage for effective thermal conductivity are available. Redundant solder can be controlled in AuSn vapor deposition on the LD bonding area.
Features
Materials
Composition
W90/Cu10
Thermal conductivity
170W/m・K
CTE (coefficient of thermal expansion)
6.5ppm/℃
Dimension/Tolerance
Length
Refer to the right table
Width
Thickness
Surface roughness
Ra<0.4
Warpage
< 5.0μm
Edge radius
< 20.0μm
Metallization
All surface
Ni 1.0-5.0μm/Au 0.1-0.3μm
AuSn solder
Composition
Au75/Sn25(wt%)
Thickness
5μm ±1μm
Options
Material selection（W80 / Cu20）
Sputtering layer（Ti, Pt, Au etc.)
Additional structure (Hole, Step)
Note: These are standard specifications. In case you have any request other than the above, please feel free to contact us.
Enlarged view
Standard specifications（Unit：mm）
Length（±0.05）
Width（±0.05）
Thickness（±0.02）
10.6
2.0
0.20 0.25 0.30 0.40
3.0
4.0
5.6
5.6
End user market / Applications
Industrial laser
・Laser equipment for welding, cutting, marking, surface treatment(e.g. annealing), etc ・Medical laser equipment for ophthalmology and epilation, and endoscopes,etc
