Micro-hole glass
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Outline
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| Anodic bonding with a silicon wafer can result in solving the out-gas issue. It can be used in the wafer-level-packaging (WLP) process. |
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Features
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●Micro-hole processing
・min. size φ0.1mm
●Max. glass size φ300 mm
（Some processes are only available up to ø200 mm wafer max.) |
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Improve bonding yield of device wafers
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● Suppress sagging around the holes
● Minimize chipping size
・≦10μm is available |
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| Standard specifications |
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| Material |
Glass |
| Glass size |
≦φ300mm(*) |
| Min. thickness |
0.15mm |
| Thickness tolerance |
±0.01mm |
| Min. hole size |
φ0.1mm |
| Hole shape |
upon request |
| Hole size tolerance |
±0.02mm |
| Chipping |
≦100μm |
| Cross section shape |
Straight / Taper / Step |
| Metallization process |
Available |
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Note: These are standard specifications.
In case you have any request except for this, please feel free to contact us. |
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End user market / Applications
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| Automotive |
・Pressure sensors, Acceleration sensors.
・Gyroscopes,etc |
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| Semiconductors |
・RF-MEMS switches.
・Image sensors,etc |
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