Bonding
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Assembled parts with metal and insulated ceramic by solder
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It is possible to assemble each part with solder, which is processed by our micro machine processing and metallization.
Solder type: AuSn, AuGe, AgCu etc. |
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| Mounts/carriers |
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Carriers for optical communication |
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Products processed by this technology
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| This product has seven-layer of Cu and Mo which are formed into a 1.6 mm thickness, leading to the control of CTE less than 8 ppm/K. The two technologies below are applied. |
| ・Three-layer forming of central Cu-Mo-Cu by electroforming |
| ・Seven-layer forming into the thickness with the three-layer above, bonded by AuSn solder |
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| With the technologies above, our customized microchannel cooler with LD-mounted on has achieved 5,000 hour endurance time in a continuous work test. |
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| We have optimized pressure distribution, turbulence kinetic energy distribution, and velocity distribution for our standard products by simulating various microchannels on a design stage. Those can be re-designed according to customers’ needs. |
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Products processed by this technology
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Conductive-through-metal-via processing
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| This borosilicate glass wafer has a large number of through-conductive-metal-vias, which gives it electrical conductivity. The maximum size of wafer is φ 200 mm. Anodic bonding can be applied to seal a silicon device. |
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| Through glass via（φ0.3mm、10,296 vias） |
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| Example applied for RF-MEMS switch |
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Products processed by this technology
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| Anodic bonding is the bonding method where heat and voltage are applied to the borosilicate glass and silicon. It can achieve high-quality bonding because adhesive or solder is not used in the process. |
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Products processed by this technology
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