“Cross-edge” micro processing　Kiru・Kezuru・Migaku home
  • Sharp edge without burr processing for metal
  • Glass chipping less processing
  • Micro hole and cavity processing
  • Special polishing
Sharp edge without burr processing for metal

Without burr processing for metal
（Sharp edge is available）

CuW（Au plating）

L±0.01

T±0.01


　　　　　　 【Unit : ㎜】

Cutting, Plating
  • 2-1.Sharp edge : Radius 0.005mm Max (Au plating is available)
  • 2-2.Surface roughness (actual measurement average) : Ra0.38um

×10

×100

×100

Side surface

Flatness of LD mounting area : Warpage : 1um
Surface roughness : Ra ＜0.05um
Sharp Edge : R ＜3um

Heatsink for laser diode

Surface roughness : Ra ＜0.05um

Edge Radius ＜10μm
【target 5μm】
Comment :
Sharp edge without burr processing for special metals such as CuW, Kovar, Cu is available.
Application :
Heatsinks for high power laser diode. Heatsinks for opt-communication. etc.
Brochure Download
Brochure Download
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Glass chipping less processing
Chipping less dicing processing

Top side

Chipping less dicing processing　Top sideChipping 0.01mm Max

Bottom side

Chipping less dicing processing　Bottom side

Chipping 0.01mm Max

Borofloat glass 0.5mm thickness
Conventional dicing processing

Top side

Conventional dicing processing　Top sideChipping 0.03mm Max

Bottom side

Conventional dicing processing　Bottom sideChipping 0.04mm Max
Comment :
0.35×0.35mm dicing processing from glass wafer with 0.5 mm thickness.
We succeeded in decreasing the chipping size significantly during glass dicing process with tape.
It makes possible to process to high aspect ration and micro size chip.
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Micro though hole and groove processing
Drilling
Drilling

■Micro though hole processing

For mass production
  • Thickness : 0.4mm
  • Hole diameter : φ0.2mm
微細穴あけ加工
DevelopmentHole diameter : φ0.05mm

■Micro groove processing

Micro groove processing

【Feature of drill processing】

  • Realization of micro though hole processing
  • Rectangular cavity processing
  • No initial tooling cost
  • Mass production is available due to using our original developed drilling tool
Sandblast
Sandblast

■Sandblast（Chipping less）

Sandblast(Taper shape) Sandblast(Taper shape)
Reference: Sandblast processing
(Taper shape)
Usual processing

Glass

Usual processing
Chipping less processing

Glass

Chipping less processing

【Feature of sandblast processing】

  • Flexible pattern processing is available
  • Low cost for large number of holes processing
  • High reliability of cumulative pitch tolerance
Ultrasonic drilling
Ultrasonic drilling

■Ultrasonic drilling

1.5±0.05

Spacer

6.0±0.05

Cr+Pt+Au

Glass

　　　　　　　　　　　　　　　　　　【Unit : ㎜】超音波穴加工

【Feature of Ultrasonic drilling】

  • Holing process with thick glass wafer up to 4 mm at one time is available
  • Possible to hole the wafer bonded with glass and silicon by anodic bonding
Brochure Download
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Special polishing

Usual polishing

Usual polishing

Special polishing (No slope around the edge of the hole)

Special polishing (Non slope around the edge of the hole)
Comment :
In case polishing fragile materials with through-holes, slope usually occurs around the edge of the hole. But it is possible to achieve sharp edge around the holes by our special polising.
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